ligitek electronics co.,ltd. property of ligitek only data sheet LUR9653H-30B doc. no : qw0905-LUR9653H-30B rev. : b date : 22 - may. - 2006 square with 4leads type led lamps pb lead-free parts
anode cathode c1.25 r0.7 ligitek electronics co.,ltd. property of ligitek only page 1/5 package dimensions part no. LUR9653H-30B 30 60 75%100% 25%50% -30 directivity radiation 0 25% 75%50% 100% -60 0 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 4.4 0.5 3.5 0.5 2.5 0.5 5.08 0.3 0.4 1.55 5.08 0.5 7.62 0.5 3.0 7.62 0.5 1.9
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) absolute maximum ratings at ta=25 material part no algainp/gap LUR9653H-30B water clear red emittedlens color storage temperature operating temperature tstg t opr pd power dissipation reverse current @5v electrostatic discharge( * ) esd ir peak forward current duty 1/10@10khz forward current i fp i f parameter symbol spectral halfwidth nm forward voltage @20ma(v) viewing angle 2 1/2 (deg) luminous intensity @20ma(mcd) dominant wave length dnm 630 1.7 20 min. 1500 900 2.665 typ. max.min. -40 ~ +100 -40 ~ +85 page 2/5 mw 130 2000 10 v a 100 70 ma ma ur(h) ratings unit ligitek electronics co.,ltd. property of ligitek only static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. LUR9653H-30B
fig.4 relative intensity vs. temperature 3.0 2.5 2.0 1.5 0.5 1.0 0.0 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 550 0.0 0.5 600650700 fig.3 forward voltage vs. temperature 0 fig.5 relative intensity vs. wavelength ambient temperature( ) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 -40 0.8 -20 1.0 0.9 1.1 1.2 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 80 40 2060100 ambient temperature( ) -20 -4020 060 4080100 3.0 2.0 1.0 1.5 2.5 fig.2 relative intensity vs. forward current typical electro-optical characteristics curve 0.5 0.0 ligitek electronics co.,ltd. property of ligitek only fig.1 forward current vs. forward voltage forward voltage(v) f o r w a r d c u r r e n t ( m a ) 1.0 0 1 1.5 10 1 100 ur(h) chip 1000 r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a 2.02.53.0 3/5 page forward current(ma) 1101001000 3.5 part no. LUR9653H-30B
dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 4/5 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max 60 seconds max part no. LUR9653H-30B
reference standard description page 5/5 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 test condition test item reliability test: 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) operating life test low temperature storage test high temperature storage test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles high temperature high humidity test thermal shock test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. ligitek electronics co.,ltd. property of ligitek only mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to see soldering well performed or not. solder resistance test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=260 5 2.dwell time= 10 1sec. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 part no. LUR9653H-30B
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